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Sun Microsystems Blade 6000 Server

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Condition: Refurbished
Oracle's Sun Blade 6000 chassis is uniquely designed to support a range of application environments by integrating Oracle's x86 and SPARC server blade modules with high capacity networking and storage blades. This extremely eco-efficient and flexible blade enclosure provides a solid foundation for the most demanding traditional and virtualized applications.

Sun Blade 6000 Chassis Specifications

Architecture

Form Factor

10 rack units high (10U), holding up to 10 server modules per chassis; up to four Sun

Blade 6000 chassis are supported per 42U rack

I/O Interfaces

The Sun Blade 6000 chassis midplane supports the following protocols: PCIe 2.0, SAS 2.0,

SATA 3.0, and Gigabit Ethernet (GbE); each server module has a direct connection to two

PCIe EMs for discrete I/O connectivity and two NEMs for aggregate I/O connectivity

I/O Modules

Up to 20 PCIe EMs per Sun Blade 6000 Chassis (two per server module)

Up to two NEMs per Sun Blade 6000 Chassis

Manageability

Chassis Monitoring Module (CMMs)

Helps enable direct remote connection to the service processor on each blade server

Reduces cabling by providing a single management connection to the chassis

Helps ensure complete remote lights-out manageability of the whole chassis

Provides an optional aggregate point for monitoring of chassis fans and power

+$664'*+&7',0&,0*&:==5+&#7(&;(,*D%2,*d Lights Out Manager (ILOM) module

Environment

Temperature

Operating: 5°C to 32°C (41°F to 90°F)

Nonoperating: -40°C to 65°C (-40°F to 149°F)

Optimum Ambient

22°C (71.6°F)

Relative Humidity

Operating: 10%C90%, noncondensing, 27°C max. wet bulb

Nonoperating: 5%C93%, noncondensing, 38°C max. wet bulb

Altitude

Operating: Up to 3,048m (10,000 ft.), max. ambient temperature is derated by 1°C

per 300 m (984 ft.) above 900 m (2,953 ft.)

Nonoperating: Up to 12,000 m (39,370 ft.)

Sine Vibration

Operating: Z (vertical) axis: 0.15 G, XCY axis: 0.10 G, 5 HzC500 Hz sine

Nonoperating: Z (vertical) axis: 0.50 G, XCY axis: 0.25 G, 5 HzC500 Hz sine

Shock

ORACLE DATA SHEET

4!

3 Gs, 11 msec, half sine (rackmounted enclosure)

Acoustic Noise

LwAd (1 B = 10 dB) 8.6 B at or below 25°C, 9.2 B at max. ambient

AC Power

Power (1+1) high-efficiency, hot-swappable, load-sharing, load-balancing power

supplies

AC input power: 1+1 PSU rating, 6,272 W, or 6,400 VA each power supply module

Voltage: 200C240 V AC

Frequency: 50 HzC60 Hz

Current: 16 A per power supply input, total four AC inputs (two per power supply)

AC Input Connection

Americas/domestic: NEMA L6-20P to IEC 320-C19

International: IEC 309, 250 V, 16 A, 3Pin to IEC 320-C19

DC Power

DC output power: 1+1 PSU rating: 5,600 W each power supply module

Regulations

Product safety: UL/CSA 60950-1, EN 60950-1, IEC 60950-1 CB Scheme with all

country differences, IEC 825-1, 2, CFR 21 Part 1040, CNS 14336, GB 4943

RFI/EMI (Class A): EN 55022, 47 CFR 15B, ICES-003, VCCI, AS/NZ 3548, CNS

13438, KSC 5858, GB 9254, EN 61000-3-2, GB 17625.1, EN 61000-3-3, EN 300

386: v1.3.3

Immunity: EN 55024, EN 300 386: v1.3.3

Certifications

Product safety: cULus Mark, UL/Demko LVD, CE Mark 2006/95/EC), GOST-R,

BSMI

RFI/EMI (Class A): CE Mark (89/336/EEC), FCC, ICES-003, VCCI, C-Tick, MIC,

GOST-R, BSMI

Immunity: CE Mark (89/336/EEC), MIC, GOST-R

Other: Labeled per WEEE (Waste Electrical and Electronic Equipment) Directive,

China RoHS Mark

Chassis Dimensions and Weight

Height: 438.15 mm (17.25 in.)

Depth: 692.15 mm (27.25 in.)

Width: 444.50 mm (17.50 in.)

Weight of a fully configured system: 159 kg (350 lb.)

Weight of an empty system (no fillers): 35.7 kg (78.7 lb.)

Subassembly Weights

Power supply module: 9.70 kg (21.38 lb.)

NEM: 1.75 kg (3.85 lb.)

PCIe EM: 0.41 kg (0.90 lb.)

Rear fan module: 1.04 kg (2.31 lb.)

CMM: 0.52 kg (1.15 lb.)

Front fan module: 0.88 kg (1.95 lb.)

Front indicator module: 0.34 kg (0.75 lb.)

 

 
 
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